A Study on the Microstructure of Sn-Ag-Cu Lead-Free Solder Joints in Pulse-Heated Reflow Soldering

Milad Mostofizadeh (Invited lecturer)

    Activity: Talk or presentationInvited lecture

    Period2011
    Event titleThe IMAPS Nordic Annual Conference 2011, 5-8 June 2011, Espoo, Finland
    Event typeConference

    Country of activity

    • Sweden

    Publication forum classification

    • No publication forum level