A Long-term reliability of adhesive flip chip joints using very thin chips

A. Seppälä; I. Suominen; E. Ristolainen

A Long-term reliability of adhesive flip chip joints using very thin chips

A. Seppälä, I. Suominen, E. Ristolainen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

7 Citations (Scopus)

Translated title of the contribution	A Long-term reliability of adhesive flip chip joints using very thin chips
Original language	English
Title of host publication	Proceedings of First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Incorporating POLY, PEP & Adhesives in Electronics, Polytronic 2001, Potsdam, Germany, October 21-24, 2001
Place of Publication	Saksa
Pages	196-201
Publication status	Published - 2001
Publication type	A4 Article in conference proceedings

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Cite this

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title = "A Long-term reliability of adhesive flip chip joints using very thin chips",

author = "A. Sepp{\"a}l{\"a} and I. Suominen and E. Ristolainen",

note = "ISBN 0-7803-7220-4<br/>Contribution: organisation=ele,FACT1=1",

year = "2001",

language = "English",

isbn = "0-7803-7220-4",

pages = "196--201",

booktitle = "Proceedings of First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Incorporating POLY, PEP & Adhesives in Electronics, Polytronic 2001, Potsdam, Germany, October 21-24, 2001",

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A Long-term reliability of adhesive flip chip joints using very thin chips. / Seppälä, A.; Suominen, I.; Ristolainen, E.
Proceedings of First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Incorporating POLY, PEP & Adhesives in Electronics, Polytronic 2001, Potsdam, Germany, October 21-24, 2001. Saksa, 2001. p. 196-201.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A Long-term reliability of adhesive flip chip joints using very thin chips

AU - Seppälä, A.

AU - Suominen, I.

AU - Ristolainen, E.

N1 - ISBN 0-7803-7220-4<br/>Contribution: organisation=ele,FACT1=1

PY - 2001

Y1 - 2001

M3 - Conference contribution

SN - 0-7803-7220-4

SP - 196

EP - 201

BT - Proceedings of First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Incorporating POLY, PEP & Adhesives in Electronics, Polytronic 2001, Potsdam, Germany, October 21-24, 2001

CY - Saksa

ER -