ACF flip chip joints on LCP substrates with thin chips

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

5 Citations (Scopus)

Translated title of the contribution	ACF flip chip joints on LCP substrates with thin chips
Original language	English
Title of host publication	15th European Microelectronics and Packaging Conference & Exhibition, June 12-15, 2005, Brugge, Belgium
Pages	272-277
Publication status	Published - 2005
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{bee1d74b0f2446fc990eb5dbc7249bcd,

title = "ACF flip chip joints on LCP substrates with thin chips",

author = "L. Frisk and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2005",

language = "English",

pages = "272--277",

booktitle = "15th European Microelectronics and Packaging Conference \& Exhibition, June 12-15, 2005, Brugge, Belgium",

}