Additive Manufactured Compliant Surface Reflectance Sensor

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Abstract

In this paper1, we present an additive manufacturing (AM) method to implement structural electronics using an off-the-shelf fused deposition modeling (FDM) 3D printer with thermoplastic polyurethane (TPU) filament, conductive silver ink, and electronics components in standard packages. As a demonstrator, a surface reflectance sensor has been implemented. The structure consists of several 3D-printed TPU layers, 3D channels for the conductors, and cavities for components. A comparison is made between the performance of a traditional implementation on rigid PCB and the new sensor. The study shows that the chosen approach can be used for AM structural electronics.
Original languageEnglish
Title of host publication2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
PublisherIEEE
Number of pages4
ISBN (Electronic)978-1-6654-5733-0
ISBN (Print)978-1-6654-9353-6
DOIs
Publication statusPublished - 28 Aug 2023
Publication typeA4 Article in conference proceedings
EventIEEE International Conference on Flexible and Printable Sensors and Systems - Northeastern University - Interdisciplinary Science and Engineering Complex, Boston, United States
Duration: 9 Jul 202312 Jul 2023
https://2023.ieee-fleps.org/

Publication series

NameIEEE International Conference on Flexible and Printable Sensors and Systems
ISSN (Print)2832-8248
ISSN (Electronic)2832-8256

Conference

ConferenceIEEE International Conference on Flexible and Printable Sensors and Systems
Abbreviated titleFLEPS
Country/TerritoryUnited States
CityBoston
Period9/07/2312/07/23
Internet address

Publication forum classification

  • Publication forum level 1

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