Analysis of Laser Bar Bonding Reliability on Different Substrates

T. Alander, P. Heino, E. Ristolainen

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Translated title of the contribution	Analysis of Laser Bar Bonding Reliability on Different Substrates
Original language	English
Pages (from-to)	160-172
Journal	International Journal of Microcircuits & Electronic Packaging
Volume	24
Issue number	2
Publication status	Published - 2001
Publication type	A1 Journal article-refereed

Publication forum classification

@article{55766bd63edc48c8856d9089a6c215d4,

title = "Analysis of Laser Bar Bonding Reliability on Different Substrates",

author = "T. Alander and P. Heino and E. Ristolainen",

note = "ISSN 1063-1674; JCR:ei; Ulrich's; Refereed<br/>Contribution: organisation=ele,FACT1=1",

year = "2001",

language = "English",

volume = "24",

pages = "160--172",

journal = "International Journal of Microcircuits \& Electronic Packaging",

number = "2",

}

TY - JOUR

T1 - Analysis of Laser Bar Bonding Reliability on Different Substrates

AU - Alander, T.

AU - Heino, P.

AU - Ristolainen, E.

N1 - ISSN 1063-1674; JCR:ei; Ulrich's; Refereed<br/>Contribution: organisation=ele,FACT1=1

PY - 2001

Y1 - 2001

M3 - Article

VL - 24

SP - 160

EP - 172

JO - International Journal of Microcircuits & Electronic Packaging

JF - International Journal of Microcircuits & Electronic Packaging

IS - 2

ER -