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Application and Modeling of Via Fences With Different Via Diameters

  • T. Tarvainen
  • , R. Mäkinen
  • , M. Vahtola

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

    1 Citation (Scopus)
    Translated title of the contributionApplication and Modeling of Via Fences With Different Via Diameters
    Original languageEnglish
    Title of host publicationProceedings of the International Conference on Electromagnetics in Advanced Applications, ICEAA'03, September 8-12, 2003, Torino, Italy
    Pages303-306
    Publication statusPublished - 2003
    Publication typeB3 Article in conference proceedings

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