Application of wide-band material characterization methods to printable electronics

Vesa J. Pynttäri; Riku M. Mäkinen; Vamsi Krishna Palukuru; Kauko Östman; Hannu P. Sillanpää; Tomi Kanerva; Toivo Lepistö; Juha Hagberg; Heli Jantunen

doi:10.1109/TEPM.2010.2051809

Application of wide-band material characterization methods to printable electronics

Vesa J. Pynttäri, Riku M. Mäkinen, Vamsi Krishna Palukuru, Kauko Östman, Hannu P. Sillanpää, Tomi Kanerva, Toivo Lepistö, Juha Hagberg, Heli Jantunen

Research output: Contribution to journal › Article › Scientific › peer-review

12 Citations (Scopus)

Translated title of the contribution	Application of wide-band material characterization methods to printable electronics
Original language	English
Pages (from-to)	221-227
Journal	IEEE Transactions on Electronics Packaging Manufacturing
Volume	33
Issue number	3
DOIs	https://doi.org/10.1109/TEPM.2010.2051809
Publication status	Published - 2010
Publication type	A1 Journal article-refereed

Publication forum classification

Publication forum level 1

Access to Document

10.1109/TEPM.2010.2051809

Cite this

@article{70516dd72d5b4c1d946006dcf91faee1,

title = "Application of wide-band material characterization methods to printable electronics",

author = "Pyntt{\"a}ri, {Vesa J.} and M{\"a}kinen, {Riku M.} and Palukuru, {Vamsi Krishna} and Kauko {\"O}stman and Sillanp{\"a}{\"a}, {Hannu P.} and Tomi Kanerva and Toivo Lepist{\"o} and Juha Hagberg and Heli Jantunen",

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year = "2010",

doi = "10.1109/TEPM.2010.2051809",

language = "English",

volume = "33",

pages = "221--227",

journal = "IEEE Transactions on Electronics Packaging Manufacturing",

issn = "1521-334X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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TY - JOUR

T1 - Application of wide-band material characterization methods to printable electronics

AU - Pynttäri, Vesa J.

AU - Mäkinen, Riku M.

AU - Palukuru, Vamsi Krishna

AU - Östman, Kauko

AU - Sillanpää, Hannu P.

AU - Kanerva, Tomi

AU - Lepistö, Toivo

AU - Hagberg, Juha

AU - Jantunen, Heli

N1 - Contribution: organisation=ele,FACT1=0.67<br/>Contribution: organisation=mol,FACT2=0.33

PY - 2010

Y1 - 2010

U2 - 10.1109/TEPM.2010.2051809

DO - 10.1109/TEPM.2010.2051809

M3 - Article

SN - 1521-334X

VL - 33

SP - 221

EP - 227

JO - IEEE Transactions on Electronics Packaging Manufacturing

JF - IEEE Transactions on Electronics Packaging Manufacturing

IS - 3

ER -