Application of wide-band material parameter extraction techniques to printable electronics characterization

H. Sillanpää; J. Lilja; R. Mäkinen; K. Östman; V. Palukuru; J. Virtanen; V. Pynttäri; T. Kanerva; J. Hagberg; T. Lepistö; H. Jantunen; P. Mansikkamäki

doi:10.1109/ECTC.2009.5074187

Application of wide-band material parameter extraction techniques to printable electronics characterization

H. Sillanpää, J. Lilja, R. Mäkinen, K. Östman, V. Palukuru, J. Virtanen, V. Pynttäri, T. Kanerva, J. Hagberg, T. Lepistö, H. Jantunen, P. Mansikkamäki

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

12 Citations (Scopus)

Translated title of the contribution	Application of wide-band material parameter extraction techniques to printable electronics characterization
Original language	English
Title of host publication	ECTC 2009, 59th Electronic Components & Technology Conference, May 26-29, 2009, San Diego, USA
Pages	1342-1348
DOIs	https://doi.org/10.1109/ECTC.2009.5074187
Publication status	Published - 2009
Publication type	A4 Article in conference proceedings

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Access to Document

10.1109/ECTC.2009.5074187

Cite this

Sillanpää, H., Lilja, J., Mäkinen, R., Östman, K., Palukuru, V., Virtanen, J., Pynttäri, V., Kanerva, T., Hagberg, J., Lepistö, T., Jantunen, H., & Mansikkamäki, P. (2009). Application of wide-band material parameter extraction techniques to printable electronics characterization. In ECTC 2009, 59th Electronic Components & Technology Conference, May 26-29, 2009, San Diego, USA (pp. 1342-1348) https://doi.org/10.1109/ECTC.2009.5074187

@inproceedings{3b91a7418f5e4dd3b8a1415b24928e5b,

title = "Application of wide-band material parameter extraction techniques to printable electronics characterization",

author = "H. Sillanp{\"a}{\"a} and J. Lilja and R. M{\"a}kinen and K. {\"O}stman and V. Palukuru and J. Virtanen and V. Pyntt{\"a}ri and T. Kanerva and J. Hagberg and T. Lepist{\"o} and H. Jantunen and P. Mansikkam{\"a}ki",

note = "Contribution: organisation=ele,FACT1=0.67<br/>Contribution: organisation=mol,FACT2=0.33",

year = "2009",

doi = "10.1109/ECTC.2009.5074187",

language = "English",

pages = "1342--1348",

booktitle = "ECTC 2009, 59th Electronic Components & Technology Conference, May 26-29, 2009, San Diego, USA",

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Sillanpää, H, Lilja, J, Mäkinen, R, Östman, K, Palukuru, V, Virtanen, J, Pynttäri, V, Kanerva, T, Hagberg, J, Lepistö, T, Jantunen, H & Mansikkamäki, P 2009, Application of wide-band material parameter extraction techniques to printable electronics characterization. in ECTC 2009, 59th Electronic Components & Technology Conference, May 26-29, 2009, San Diego, USA. pp. 1342-1348. https://doi.org/10.1109/ECTC.2009.5074187

Application of wide-band material parameter extraction techniques to printable electronics characterization. / Sillanpää, H.; Lilja, J.; Mäkinen, R. et al.
ECTC 2009, 59th Electronic Components & Technology Conference, May 26-29, 2009, San Diego, USA. 2009. p. 1342-1348.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Application of wide-band material parameter extraction techniques to printable electronics characterization

AU - Sillanpää, H.

AU - Lilja, J.

AU - Mäkinen, R.

AU - Östman, K.

AU - Palukuru, V.

AU - Virtanen, J.

AU - Pynttäri, V.

AU - Kanerva, T.

AU - Hagberg, J.

AU - Lepistö, T.

AU - Jantunen, H.

AU - Mansikkamäki, P.

N1 - Contribution: organisation=ele,FACT1=0.67<br/>Contribution: organisation=mol,FACT2=0.33

PY - 2009

Y1 - 2009

U2 - 10.1109/ECTC.2009.5074187

DO - 10.1109/ECTC.2009.5074187

M3 - Conference contribution

SP - 1342

EP - 1348

BT - ECTC 2009, 59th Electronic Components & Technology Conference, May 26-29, 2009, San Diego, USA

ER -