Characterising embedded applications using a UML profile

S. Määttä; L. S. Indrusiak; L. Ost; L. Möller; M. Glesner; F. Moraes; J. Nurmi

Characterising embedded applications using a UML profile

S. Määttä, L. S. Indrusiak, L. Ost, L. Möller, M. Glesner, F. Moraes, J. Nurmi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

6 Citations (Scopus)

Translated title of the contribution	Characterising embedded applications using a UML profile
Original language	English
Title of host publication	Proceedings of the 2009 International Symposium on System-on-Chip, 5-7 October, 2009, Tampere, Finland
Editors	J. Nurmi, J. Takala, O. Vainio
Pages	172-175
Publication status	Published - 2009
Publication type	A4 Article in conference proceedings

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Cite this

@inproceedings{0a26d1e066294e02b8b0a37c71053ea1,

title = "Characterising embedded applications using a UML profile",

author = "S. M{\"a}{\"a}tt{\"a} and Indrusiak, {L. S.} and L. Ost and L. M{\"o}ller and M. Glesner and F. Moraes and J. Nurmi",

note = "Contribution: organisation=tkt,FACT1=1",

year = "2009",

language = "English",

isbn = "978-1-4244-4465-6",

pages = "172--175",

editor = "J. Nurmi and J. Takala and O. Vainio",

booktitle = "Proceedings of the 2009 International Symposium on System-on-Chip, 5-7 October, 2009, Tampere, Finland",

}

Characterising embedded applications using a UML profile. / Määttä, S.; Indrusiak, L. S.; Ost, L. et al.
Proceedings of the 2009 International Symposium on System-on-Chip, 5-7 October, 2009, Tampere, Finland. ed. / J. Nurmi; J. Takala; O. Vainio. 2009. p. 172-175.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Characterising embedded applications using a UML profile

AU - Määttä, S.

AU - Indrusiak, L. S.

AU - Ost, L.

AU - Möller, L.

AU - Glesner, M.

AU - Moraes, F.

AU - Nurmi, J.

N1 - Contribution: organisation=tkt,FACT1=1

PY - 2009

Y1 - 2009

M3 - Conference contribution

SN - 978-1-4244-4465-6

SP - 172

EP - 175

BT - Proceedings of the 2009 International Symposium on System-on-Chip, 5-7 October, 2009, Tampere, Finland

A2 - Nurmi, J.

A2 - Takala, J.

A2 - Vainio, O.

ER -