Characterization of a new solder mask material for flip chip using JEDEC level 1 humidity life test and single lap shear test

P. Palm, J. Määttänen, A. Tuominen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

    Translated title of the contributionCharacterization of a new solder mask material for flip chip using JEDEC level 1 humidity life test and single lap shear test
    Original languageEnglish
    Title of host publication36th IMAPS Nordic Conference, 19-22 September 1999, Helsinki
    Pages221-225
    Publication statusPublished - 1999
    Publication typeB3 Non-refereed article in conference proceedings

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