Characterization of ICA attachment of SMD on inkjet-printed substrates

Juha Niittynen, Ville Pekkanen, Matti Mäntysalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Translated title of the contribution	Characterization of ICA attachment of SMD on inkjet-printed substrates
Original language	English
Title of host publication	60th Electronic Components & Technology Conference ECTC, June 1 - 4, 2010, Las Vegas, Nevada, USA
Pages	990-997
DOIs	https://doi.org/10.1109/ECTC.2010.5490822
Publication status	Published - 2010
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{a0e94b56d3d34341972f2f5b4f5bd938,

title = "Characterization of ICA attachment of SMD on inkjet-printed substrates",

author = "Juha Niittynen and Ville Pekkanen and Matti M{\"a}ntysalo",

note = "Contribution: organisation=ele,FACT1=1",

year = "2010",

doi = "10.1109/ECTC.2010.5490822",

language = "English",

pages = "990--997",

booktitle = "60th Electronic Components & Technology Conference ECTC, June 1 - 4, 2010, Las Vegas, Nevada, USA",

}

TY - GEN

T1 - Characterization of ICA attachment of SMD on inkjet-printed substrates

AU - Niittynen, Juha

AU - Pekkanen, Ville

AU - Mäntysalo, Matti

N1 - Contribution: organisation=ele,FACT1=1

PY - 2010

Y1 - 2010

U2 - 10.1109/ECTC.2010.5490822

DO - 10.1109/ECTC.2010.5490822

M3 - Conference contribution

SP - 990

EP - 997

BT - 60th Electronic Components & Technology Conference ECTC, June 1 - 4, 2010, Las Vegas, Nevada, USA

ER -