Characterization of thermally aged immersion tin plated PCBs

J. Sundelin, T. Lepistö

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Translated title of the contributionCharacterization of thermally aged immersion tin plated PCBs
    Original languageEnglish
    Title of host publicationScandem 2003, Proceedings Book, 10-13 June 2003, Oslo, Norway
    EditorsS. Jorgensen, A.E. Gunnaes
    Pages133-134
    Publication statusPublished - 2003
    Publication typeA4 Article in conference proceedings

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