Comparison of induced stresses due to electroless versus sputtered copper interconnect technology

P.J. McNally, J. Kanatharana, B.H.W. Toh, D.W. McNeill, T. Tuomi, A.N. Danilewsky, L. Knuuttila, J. Riikonen, J. Toivonen

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Translated title of the contributionComparison of induced stresses due to electroless versus sputtered copper interconnect technology
Original languageEnglish
Pages (from-to)1280-1284
JournalSemiconductor Science and Technology
Volume19
Issue number11
DOIs
Publication statusPublished - 2004
Externally publishedYes
Publication typeA1 Journal article-refereed

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