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Comparison of induced stresses due to electroless versus sputtered copper interconnect technology

  • P.J. McNally
  • , J. Kanatharana
  • , B.H.W. Toh
  • , D.W. McNeill
  • , T. Tuomi
  • , A.N. Danilewsky
  • , L. Knuuttila
  • , J. Riikonen
  • , J. Toivonen

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)
Translated title of the contributionComparison of induced stresses due to electroless versus sputtered copper interconnect technology
Original languageEnglish
Pages (from-to)1280-1284
JournalSemiconductor Science and Technology
Volume19
Issue number11
DOIs
Publication statusPublished - 2004
Externally publishedYes
Publication typeA1 Journal article-refereed

Publication forum classification

  • Publication forum level 1

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