@inproceedings{9ed59237f1b44404a31457c665aa0ad0,
title = "Complexity Analysis of Next-Generation HEVC Decoder",
abstract = "This paper analyzes the complexity of the HEVC video decoder being developed by the JCT-VC community. The HEVC reference decoder HM 3.1 is profiled with Intel VTune on Intel Core 2 Duo processor. The analysis covers both Low Complexity (LC) and High Efficiency (HE) settings for resolutions varying from WQVGA (416 × 240 pixels) up to 1600p (2560 × 1600 pixels). The yielded cycle-accurate results are compared with the respective results of H.264/AVC Baseline Profile (BP) and High Profile (HiP) reference decoders. HEVC offers significant improvement in compression efficiency over H.264/AVC: the average BD-rate saving of LC is around 51% over BP whereas the BD-rate gain of HE is around 45% over HiP. However, the average decoding complexities of LC and HE increase by 61% and 87% over BP and HiP, respectively. In LC, the most complex functions are motion compensation (MC) and loop filtering (LF) that account on average for 50% and 14% of the decoder complexity. The decoding complexity of HE configuration is on average 42% higher than that of the LC configuration. Majority of the difference is caused by extra LF stages. In HE, the complexities of MC and LF are 37% and 32%, respectively. In practice, a standard 3 GHz dual core processor is expected to be able to decode 1080p HEVC content in real-time.",
author = "Marko Viitanen and Jarno Vanne and H{\"a}m{\"a}l{\"a}inen, {Timo D.} and Moncef Gabbouj and Jani Lainema",
note = "Contribution: organisation=tkt,FACT1=0.5<br/>Contribution: organisation=sgn,FACT2=0.5<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE; IEEE International Symposium on Circuits and Systems ; Conference date: 01-01-1900",
year = "2012",
doi = "10.1109/ISCAS.2012.6272182",
language = "English",
isbn = "978-1-4673-0218-0",
series = "IEEE International Symposium on Circuits and Systems",
pages = "882--885",
booktitle = "ISCAS 2012, IEEE International Symposium on Circuits and Systems, May 20-23, 2012, Seoul, Korea",
}