Conductivity and Adhesion Study of Plasma-sintered Nanoparticle Silver Ink

Juha Niittynen; Eerik Halonen; Matti Mäntysalo; Donald Lupo; Jolke Perelaer; Ulrich S. Schubert

Conductivity and Adhesion Study of Plasma-sintered Nanoparticle Silver Ink

Juha Niittynen
, Eerik Halonen
, Matti Mäntysalo
, Donald Lupo
, Jolke Perelaer
, Ulrich S. Schubert

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	Conductivity and Adhesion Study of Plasma-sintered Nanoparticle Silver Ink
Original language	English
Title of host publication	LOPE-C; Large-area, Organic & Printed Electronics Convention, June 28-30, 2011, Frankfurt, Germany
Place of Publication	Frankfurt
Publisher	Electronics Association
Pages	134-138
ISBN (Print)	978-3-00-034957-7
Publication status	Published - 2011
Publication type	A4 Article in conference proceedings

Publication series

Name	International Conference and Exhibition for the Organic and Printed Electronics Industry
Publisher	Electronics Association

Publication forum classification

No publication forum level

Cite this

Niittynen, J., Halonen, E., Mäntysalo, M., Lupo, D., Perelaer, J., & Schubert, U. S. (2011). Conductivity and Adhesion Study of Plasma-sintered Nanoparticle Silver Ink. In LOPE-C; Large-area, Organic & Printed Electronics Convention, June 28-30, 2011, Frankfurt, Germany (pp. 134-138). (International Conference and Exhibition for the Organic and Printed Electronics Industry). Electronics Association.

Niittynen, Juha ; Halonen, Eerik ; Mäntysalo, Matti et al. / Conductivity and Adhesion Study of Plasma-sintered Nanoparticle Silver Ink. LOPE-C; Large-area, Organic & Printed Electronics Convention, June 28-30, 2011, Frankfurt, Germany. Frankfurt : Electronics Association, 2011. pp. 134-138 (International Conference and Exhibition for the Organic and Printed Electronics Industry).

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title = "Conductivity and Adhesion Study of Plasma-sintered Nanoparticle Silver Ink",

author = "Juha Niittynen and Eerik Halonen and Matti M{\"a}ntysalo and Donald Lupo and Jolke Perelaer and Schubert, \{Ulrich S.\}",

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year = "2011",

language = "English",

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series = "International Conference and Exhibition for the Organic and Printed Electronics Industry",

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Niittynen, J, Halonen, E, Mäntysalo, M , Lupo, D, Perelaer, J & Schubert, US 2011, Conductivity and Adhesion Study of Plasma-sintered Nanoparticle Silver Ink. in LOPE-C; Large-area, Organic & Printed Electronics Convention, June 28-30, 2011, Frankfurt, Germany. International Conference and Exhibition for the Organic and Printed Electronics Industry, Electronics Association, Frankfurt, pp. 134-138.

Conductivity and Adhesion Study of Plasma-sintered Nanoparticle Silver Ink. / Niittynen, Juha; Halonen, Eerik; Mäntysalo, Matti et al.
LOPE-C; Large-area, Organic & Printed Electronics Convention, June 28-30, 2011, Frankfurt, Germany. Frankfurt: Electronics Association, 2011. p. 134-138 (International Conference and Exhibition for the Organic and Printed Electronics Industry).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Conductivity and Adhesion Study of Plasma-sintered Nanoparticle Silver Ink

AU - Niittynen, Juha

AU - Halonen, Eerik

AU - Mäntysalo, Matti

AU - Lupo, Donald

AU - Perelaer, Jolke

AU - Schubert, Ulrich S.

N1 - ei ut-numeroa 9.4.2014<br/>Contribution: organisation=ele,FACT1=1

PY - 2011

Y1 - 2011

M3 - Conference contribution

SN - 978-3-00-034957-7

T3 - International Conference and Exhibition for the Organic and Printed Electronics Industry

SP - 134

EP - 138

BT - LOPE-C; Large-area, Organic & Printed Electronics Convention, June 28-30, 2011, Frankfurt, Germany

PB - Electronics Association

CY - Frankfurt

ER -

Niittynen J, Halonen E, Mäntysalo M , Lupo D, Perelaer J, Schubert US. Conductivity and Adhesion Study of Plasma-sintered Nanoparticle Silver Ink. In LOPE-C; Large-area, Organic & Printed Electronics Convention, June 28-30, 2011, Frankfurt, Germany. Frankfurt: Electronics Association. 2011. p. 134-138. (International Conference and Exhibition for the Organic and Printed Electronics Industry).