Abstract
Multi-level converters are a possible solution for increasing the power density and efficiency in many power electronic systems. The increase in the number of switching components on a single device leads to a growth both in the cost of the converter and in its complexity compared to two-level solutions. However, these drawbacks are counterbalanced by a better harmonic content on the AC quantities, allowing a significant decrease in the size of the output filters and reactive power as well. Thus, three-level converters represent a good compromise between costs, system complexity and efficiency. More specifically, this paper focuses on the development of a bidirectional control for a three-phase three-level T-type converter working as an active front end to be coupled with DC/DC converters in off-board recharging stations or in renewable power plants. Moreover, a thermal analysis of the power electronics is carried out aimed to the design and the development of an ad hoc cooling system for a prototype working at 80 kW.
Original language | English |
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Title of host publication | 2023 IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering, MetroXRAINE 2023 - Proceedings |
Publisher | IEEE |
Pages | 432-437 |
Number of pages | 6 |
ISBN (Electronic) | 979-8-3503-0080-2 |
DOIs | |
Publication status | Published - 2023 |
Publication type | A4 Article in conference proceedings |
Event | IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering - Milano, Italy Duration: 25 Oct 2023 → 27 Oct 2023 |
Conference
Conference | IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering |
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Country/Territory | Italy |
City | Milano |
Period | 25/10/23 → 27/10/23 |
Keywords
- Bidirectional front-end converter
- thermal analysis
- three-level converter fast-recharging stations
- vehicle to grid
Publication forum classification
- Publication forum level 1
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
- Media Technology
- Control and Optimization
- Modelling and Simulation
- Instrumentation
- Artificial Intelligence