Controlling warpage of molded package for inkjet manufacturing

K. Kaija, V. Pekkanen, M. Mäntysalo, P. Mansikkamäki

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12 Citations (Scopus)

Translated title of the contribution	Controlling warpage of molded package for inkjet manufacturing
Original language	English
Pages (from-to)	518-526
Journal	Microelectronic Engineering
Volume	85
Issue number	3
DOIs	https://doi.org/doi:10.1016/j.mee.2007.09.010
Publication status	Published - 2008
Publication type	A1 Journal article-refereed

Publication forum classification

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title = "Controlling warpage of molded package for inkjet manufacturing",

author = "K. Kaija and V. Pekkanen and M. M{\"a}ntysalo and P. Mansikkam{\"a}ki",

note = "Contribution: organisation=ele,FACT1=1",

year = "2008",

doi = "doi:10.1016/j.mee.2007.09.010",

language = "English",

volume = "85",

pages = "518--526",

journal = "Microelectronic Engineering",

issn = "0167-9317",

publisher = "Elsevier B.V.",

number = "3",

}

TY - JOUR

T1 - Controlling warpage of molded package for inkjet manufacturing

AU - Kaija, K.

AU - Pekkanen, V.

AU - Mäntysalo, M.

AU - Mansikkamäki, P.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2008

Y1 - 2008

U2 - doi:10.1016/j.mee.2007.09.010

DO - doi:10.1016/j.mee.2007.09.010

M3 - Article

SN - 0167-9317

VL - 85

SP - 518

EP - 526

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 3

ER -