| Translated title of the contribution | Corrosion protection of anisotropically conductive adhesive joined flip chips |
|---|---|
| Original language | English |
| Pages (from-to) | 1152-1158 |
| Journal | Microelectronics Reliability |
| Volume | 50 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - 2010 |
| Publication type | A1 Journal article-refereed |
Publication forum classification
- Publication forum level 1
Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver