Creation and Evaluation of Dynamic Compact Thermal Model for System-in-Package

K. Kaija, P. Heino, E. Ristolainen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Translated title of the contributionCreation and Evaluation of Dynamic Compact Thermal Model for System-in-Package
    Original languageEnglish
    Title of host publicationProceedings of 3rd European Microelectronics and Packaging Symposium with Table Top Exhibition, 16th - 18th June 2004, Hotel Diplomat, Prague, Czech Republic
    EditorsJ. Sikula
    Pages259-264
    Publication statusPublished - 2004
    Publication typeA4 Article in conference proceedings

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