Creation and Evaluation of Dynamic Compact Thermal Model for System-in-Package

K. Kaija; P. Heino; E. Ristolainen

Creation and Evaluation of Dynamic Compact Thermal Model for System-in-Package

K. Kaija
, P. Heino
, E. Ristolainen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	Creation and Evaluation of Dynamic Compact Thermal Model for System-in-Package
Original language	English
Title of host publication	Proceedings of 3rd European Microelectronics and Packaging Symposium with Table Top Exhibition, 16th - 18th June 2004, Hotel Diplomat, Prague, Czech Republic
Editors	J. Sikula
Pages	259-264
Publication status	Published - 2004
Publication type	A4 Article in conference proceedings

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Cite this

@inproceedings{914b4c19cd2d45988acb847581bbf6a8,

title = "Creation and Evaluation of Dynamic Compact Thermal Model for System-in-Package",

author = "K. Kaija and P. Heino and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2004",

language = "English",

pages = "259--264",

editor = "J. Sikula",

booktitle = "Proceedings of 3rd European Microelectronics and Packaging Symposium with Table Top Exhibition, 16th - 18th June 2004, Hotel Diplomat, Prague, Czech Republic",

}

Creation and Evaluation of Dynamic Compact Thermal Model for System-in-Package. / Kaija, K.; Heino, P.; Ristolainen, E.
Proceedings of 3rd European Microelectronics and Packaging Symposium with Table Top Exhibition, 16th - 18th June 2004, Hotel Diplomat, Prague, Czech Republic. ed. / J. Sikula. 2004. p. 259-264.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Creation and Evaluation of Dynamic Compact Thermal Model for System-in-Package

AU - Kaija, K.

AU - Heino, P.

AU - Ristolainen, E.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2004

Y1 - 2004

M3 - Conference contribution

SP - 259

EP - 264

BT - Proceedings of 3rd European Microelectronics and Packaging Symposium with Table Top Exhibition, 16th - 18th June 2004, Hotel Diplomat, Prague, Czech Republic

A2 - Sikula, J.

ER -