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CSP rework and systems in lead-free soldering process

  • P. Nummenpää
  • , M. Toivonen
  • , T. Liukkonen
  • , A. Tuominen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

    Translated title of the contributionCSP rework and systems in lead-free soldering process
    Original languageEnglish
    Title of host publicationElektroniikan valmistus 2004, Elektroniikan tuotanto- ja pakkaustekniikan konferenssi, Pori 13. - 14.5.2004, Tampereen teknillinen yliopisto, Porin yksikkö, Julkaisusarja A
    EditorsA. Tuominen
    Pages103-105
    Number of pages3
    Publication statusPublished - 2004
    Publication typeB3 Article in conference proceedings

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