Development of high density flip chip on flex process using anisotropically conductive adhesives

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Translated title of the contribution	Development of high density flip chip on flex process using anisotropically conductive adhesives
Original language	English
Title of host publication	2000 IEMT/IMC Symposium, April 19-21, 2000, Tokyo, Japan
Pages	338-343
Publication status	Published - 2000
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{a7e76df186704b4290036e032464bd06,

title = "Development of high density flip chip on flex process using anisotropically conductive adhesives",

author = "J. M{\"a}{\"a}tt{\"a}nen and P. Palm and A. Tuominen and E. Ristolainen",

note = "Contribution: organisation=pori etp,FACT1=1",

year = "2000",

language = "English",

pages = "338--343",

booktitle = "2000 IEMT/IMC Symposium, April 19-21, 2000, Tokyo, Japan",

}

TY - GEN

T1 - Development of high density flip chip on flex process using anisotropically conductive adhesives

AU - Määttänen, J.

AU - Palm, P.

AU - Tuominen, A.

AU - Ristolainen, E.

N1 - Contribution: organisation=pori etp,FACT1=1

PY - 2000

Y1 - 2000

M3 - Conference contribution

SP - 338

EP - 343

BT - 2000 IEMT/IMC Symposium, April 19-21, 2000, Tokyo, Japan

ER -