TY - GEN
T1 - Eco-friendly flexible wireless platforms by 3D printing pen
AU - Mehmood, Adnan
AU - Chen, Xiaochen
AU - He, Han
AU - Ukkonen, Leena
AU - Virkki, Johanna
PY - 2019
Y1 - 2019
N2 - We present a new type of 3D printing pen fabrication of flexible passive UHF (ultra-high frequency) RFID (radio frequency identification) platforms. The used 3D printing material is cost-effective and fully biodegradable. The tag antenna is fabricated from conductive thread. This antenna and antenna-IC interconnections are fixed inside the 3D-printed platforms with 3D-printed fasteners. Thus, our solution requires no additional process steps or chemicals. For wireless evaluation, the platforms are firstly bended around different size cylinders, with and without a 3D-printed top layer. Further, the reliability of the platforms in high moisture is also tested, by keeping the platforms in water for 1 minute. Based on these preliminary tests, our manufacturing method enables establishment of highly reliable eco-friendly platforms with excellent wireless performance. The developed solutions have versatile future applications, especially in the field of wearable electronics, where lightweight, cost-effective, flexible, and waterproof platforms are needed.
AB - We present a new type of 3D printing pen fabrication of flexible passive UHF (ultra-high frequency) RFID (radio frequency identification) platforms. The used 3D printing material is cost-effective and fully biodegradable. The tag antenna is fabricated from conductive thread. This antenna and antenna-IC interconnections are fixed inside the 3D-printed platforms with 3D-printed fasteners. Thus, our solution requires no additional process steps or chemicals. For wireless evaluation, the platforms are firstly bended around different size cylinders, with and without a 3D-printed top layer. Further, the reliability of the platforms in high moisture is also tested, by keeping the platforms in water for 1 minute. Based on these preliminary tests, our manufacturing method enables establishment of highly reliable eco-friendly platforms with excellent wireless performance. The developed solutions have versatile future applications, especially in the field of wearable electronics, where lightweight, cost-effective, flexible, and waterproof platforms are needed.
U2 - 10.1109/PIERS-Fall48861.2019.9021887
DO - 10.1109/PIERS-Fall48861.2019.9021887
M3 - Conference contribution
SN - 978-1-7281-5305-6
T3 - 2019 Photonics and Electromagnetics Research Symposium - Fall, PIERS - Fall 2019 - Proceedings
SP - 2422
EP - 2425
BT - 2019 Photonics and Electromagnetics Research Symposium - Fall (PIERS - FALL)
PB - IEEE
T2 - Photonics and Electromagnetics Research Symposium
Y2 - 17 December 2019 through 20 December 2019
ER -