Eco-friendly flexible wireless platforms by 3D printing pen

Adnan Mehmood, Xiaochen Chen, Han He, Leena Ukkonen, Johanna Virkki

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

1 Citation (Scopus)

Abstract

We present a new type of 3D printing pen fabrication of flexible passive UHF (ultra-high frequency) RFID (radio frequency identification) platforms. The used 3D printing material is cost-effective and fully biodegradable. The tag antenna is fabricated from conductive thread. This antenna and antenna-IC interconnections are fixed inside the 3D-printed platforms with 3D-printed fasteners. Thus, our solution requires no additional process steps or chemicals. For wireless evaluation, the platforms are firstly bended around different size cylinders, with and without a 3D-printed top layer. Further, the reliability of the platforms in high moisture is also tested, by keeping the platforms in water for 1 minute. Based on these preliminary tests, our manufacturing method enables establishment of highly reliable eco-friendly platforms with excellent wireless performance. The developed solutions have versatile future applications, especially in the field of wearable electronics, where lightweight, cost-effective, flexible, and waterproof platforms are needed.

Original languageEnglish
Title of host publication2019 Photonics and Electromagnetics Research Symposium - Fall (PIERS - FALL)
Subtitle of host publicationProceedings
PublisherIEEE
Pages2422-2425
Number of pages4
ISBN (Electronic)978-1-7281-5304-9
ISBN (Print)978-1-7281-5305-6
DOIs
Publication statusPublished - 2019
Publication typeA4 Article in conference proceedings
EventPhotonics and Electromagnetics Research Symposium - Xiamen, China
Duration: 17 Dec 201920 Dec 2019

Publication series

Name2019 Photonics and Electromagnetics Research Symposium - Fall, PIERS - Fall 2019 - Proceedings

Conference

ConferencePhotonics and Electromagnetics Research Symposium
Country/TerritoryChina
CityXiamen
Period17/12/1920/12/19

Publication forum classification

  • Publication forum level 1

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics
  • Electronic, Optical and Magnetic Materials
  • Mathematical Physics

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