Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates

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Translated title of the contribution	Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates
Original language	English
Pages (from-to)	1281-1890
Journal	Microelectronics Reliability
Volume	44
Issue number	9
Publication status	Published - 2004
Publication type	A1 Journal article-refereed

Publication forum classification

@article{c8e22e5512604dfabadd5ba19d10bf17,

title = "Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates",

author = "L. Frisk and A. Sepp{\"a}l{\"a} and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2004",

language = "English",

volume = "44",

pages = "1281--1890",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Limited",

number = "9",

}