Effect of High-Humidity Testing on Material Parameters of Flexible Printed Circuit Board Materials

Sanna Lahokallio, Kirsi Saarinen, Laura Frisk

Research output: Contribution to journal › Article › Scientific › peer-review

9 Citations (Scopus)

Translated title of the contribution	Effect of High-Humidity Testing on Material Parameters of Flexible Printed Circuit Board Materials
Original language	English
Pages (from-to)	2822-2834
Number of pages	13
Journal	Journal of Electronic Materials
Volume	42
Issue number	9
DOIs	https://doi.org/10.1007/s11664-013-2652-6
Publication status	Published - 2013
Publication type	A1 Journal article-refereed

Publication forum classification

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title = "Effect of High-Humidity Testing on Material Parameters of Flexible Printed Circuit Board Materials",

author = "Sanna Lahokallio and Kirsi Saarinen and Laura Frisk",

note = "Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-07-29<br/>Publisher name: Springer New York",

year = "2013",

doi = "10.1007/s11664-013-2652-6",

language = "English",

volume = "42",

pages = "2822--2834",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

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}

TY - JOUR

T1 - Effect of High-Humidity Testing on Material Parameters of Flexible Printed Circuit Board Materials

AU - Lahokallio, Sanna

AU - Saarinen, Kirsi

AU - Frisk, Laura

N1 - Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-07-29<br/>Publisher name: Springer New York

PY - 2013

Y1 - 2013

U2 - 10.1007/s11664-013-2652-6

DO - 10.1007/s11664-013-2652-6

M3 - Article

SN - 0361-5235

VL - 42

SP - 2822

EP - 2834

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 9

ER -