Effect of PCB surface finish on creep properties of lead-free solder joints

J.J. Sundelin, S.T. Nurmi, T.K. Lepistö, E.O. Ristolainen

Research output: Contribution to journal › Article › Scientific › peer-review

4 Citations (Scopus)

Translated title of the contribution	Effect of PCB surface finish on creep properties of lead-free solder joints
Original language	English
Pages (from-to)	3-9
Journal	Soldering and Surface Mount Technology
Volume	17
Issue number	4
Publication status	Published - 2005
Publication type	A1 Journal article-refereed

Publication forum classification

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title = "Effect of PCB surface finish on creep properties of lead-free solder joints",

author = "J.J. Sundelin and S.T. Nurmi and T.K. Lepist{\"o} and E.O. Ristolainen",

note = "ISSN 0954-0911<br/>Contribution: organisation=mol,FACT1=0.5<br/>Contribution: organisation=ele,FACT2=0.5",

year = "2005",

language = "English",

volume = "17",

pages = "3--9",

journal = "Soldering and Surface Mount Technology",

issn = "0954-0911",

publisher = "Emerald Group Publishing Ltd.",

number = "4",

}

TY - JOUR

T1 - Effect of PCB surface finish on creep properties of lead-free solder joints

AU - Sundelin, J.J.

AU - Nurmi, S.T.

AU - Lepistö, T.K.

AU - Ristolainen, E.O.

N1 - ISSN 0954-0911<br/>Contribution: organisation=mol,FACT1=0.5<br/>Contribution: organisation=ele,FACT2=0.5

PY - 2005

Y1 - 2005

M3 - Article

SN - 0954-0911

VL - 17

SP - 3

EP - 9

JO - Soldering and Surface Mount Technology

JF - Soldering and Surface Mount Technology

IS - 4

ER -