Effect of thermal aging and salt spray testing on reliability and mechanical strength of Sn-58Bi lead-free solder

Milad Mostofizadeh; Juha Pippola; Tuomas Marttila; Laura Katriina Frisk

doi:10.1109/TCPMT.2013.2267333

Effect of thermal aging and salt spray testing on reliability and mechanical strength of Sn-58Bi lead-free solder

Milad Mostofizadeh
, Juha Pippola
, Tuomas Marttila
, Laura Katriina Frisk

Research output: Contribution to journal › Article › Scientific › peer-review

11 Citations (Scopus)

Translated title of the contribution	Effect of thermal aging and salt spray testing on reliability and mechanical strength of Sn-58Bi lead-free solder
Original language	English
Pages (from-to)	1778-1785
Number of pages	8
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	3
Issue number	10
DOIs	https://doi.org/10.1109/TCPMT.2013.2267333
Publication status	Published - 2013
Publication type	A1 Journal article-refereed

Publication forum classification

Publication forum level 1

Access to Document

10.1109/TCPMT.2013.2267333

Cite this

@article{6edc6c4d32414b3b90fdd1c79751fd40,

title = "Effect of thermal aging and salt spray testing on reliability and mechanical strength of Sn-58Bi lead-free solder",

author = "Milad Mostofizadeh and Juha Pippola and Tuomas Marttila and Frisk, \{Laura Katriina\}",

note = "Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-06-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE",

year = "2013",

doi = "10.1109/TCPMT.2013.2267333",

language = "English",

volume = "3",

pages = "1778--1785",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "10",

}

Effect of thermal aging and salt spray testing on reliability and mechanical strength of Sn-58Bi lead-free solder. / Mostofizadeh, Milad; Pippola, Juha; Marttila, Tuomas et al.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 3, No. 10, 2013, p. 1778-1785.

Research output: Contribution to journal › Article › Scientific › peer-review

TY - JOUR

T1 - Effect of thermal aging and salt spray testing on reliability and mechanical strength of Sn-58Bi lead-free solder

AU - Mostofizadeh, Milad

AU - Pippola, Juha

AU - Marttila, Tuomas

AU - Frisk, Laura Katriina

N1 - Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-06-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2013

Y1 - 2013

U2 - 10.1109/TCPMT.2013.2267333

DO - 10.1109/TCPMT.2013.2267333

M3 - Article

SN - 2156-3950

VL - 3

SP - 1778

EP - 1785

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 10

ER -