| Translated title of the contribution | Effects of Different Temperature Tests on the Reliability of ACA Joints |
|---|---|
| Original language | English |
| Title of host publication | 34th International Microelectronics and Packaging IMAPS-CPMT Poland Conference, September 22-25, 2010, Wroclaw, Poland |
| Pages | 1-5 |
| Number of pages | 5 |
| Publication status | Published - 2010 |
| Publication type | A4 Article in conference proceedings |
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