Abstract
This study investigates the effects of ultrasonic nanocrystalline surface modification (UNSM) on the formation of nitride layers in Ti-6Al-4V alloy during ion-plasma nitriding (IPN). Various UNSM parameters, including vibration amplitude, static load, and processing temperature, were systematically varied to evaluate their influence on microstructure, hardness, elastic modulus, and tribological behavior. The results reveal that pre-treatment with optimized UNSM conditions significantly enhances nitrogen diffusion, leading to the formation of dense and uniform TiN/Ti2N layers. Samples pre-treated under high-load and elevated-temperature UNSM exhibited the greatest improvements in surface hardness (up to 25%), elastic modulus (up to 18%), and wear resistance, with a reduced and stabilized friction coefficient (~0.55). Scanning electron microscopy (SEM) and X-ray diffraction (XRD) analyses confirmed microstructural densification, grain refinement, and increased nitride phase intensity. These findings demonstrate not only the scientific relevance but also the practical potential of UNSM as an effective surface activation technique. The hybrid UNSM + IPN approach may serve as a promising method for extending the service life of load-bearing biomedical implants and engineering components subjected to intensive wear.
| Original language | English |
|---|---|
| Article number | 3487 |
| Journal | Materials |
| Volume | 18 |
| Issue number | 15 |
| DOIs | |
| Publication status | Published - Aug 2025 |
| Publication type | A1 Journal article-refereed |
Keywords
- coefficient of friction
- elastic modulus
- hardness
- ion-plasma nitriding
- Ti-6Al-4V
- UNSM
Publication forum classification
- Publication forum level 0
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
Fingerprint
Dive into the research topics of 'Effects of Ultrasonic Nanocrystal Surface Modification on the Formation of a Nitride Layer in Ti-6Al-4V Alloy'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver