Translated title of the contribution | Electrical Design and Simulation of 3D Stacked Module |
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Original language | English |
Title of host publication | Proceedings of 3rd European Microelectronics and Packaging Symposium with Table Top Exhibition, 16th - 18th June 2004, Hotel Diplomat, Prague, Czech Republic |
Editors | J. Sikula |
Pages | 189-194 |
Publication status | Published - 2004 |
Publication type | A4 Article in conference proceedings |
Publication forum classification
- No publication forum level