Electrical Design and Simulation of 3D Stacked Module

M. Mäntysalo, J. Tanskanen, E. Ristolainen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Translated title of the contributionElectrical Design and Simulation of 3D Stacked Module
    Original languageEnglish
    Title of host publicationProceedings of 3rd European Microelectronics and Packaging Symposium with Table Top Exhibition, 16th - 18th June 2004, Hotel Diplomat, Prague, Czech Republic
    EditorsJ. Sikula
    Pages189-194
    Publication statusPublished - 2004
    Publication typeA4 Article in conference proceedings

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