| Translated title of the contribution | Electrical Design and Simulation of 3D Stacked Module |
|---|---|
| Original language | English |
| Title of host publication | Proceedings of 3rd European Microelectronics and Packaging Symposium with Table Top Exhibition, 16th - 18th June 2004, Hotel Diplomat, Prague, Czech Republic |
| Editors | J. Sikula |
| Pages | 189-194 |
| Publication status | Published - 2004 |
| Publication type | A4 Article in conference proceedings |
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