Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards

T. Laine-Ma, P. Ruuskanen, S. Kortet, M. Karttunen

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8 Citations (Scopus)

Translated title of the contribution	Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards
Original language	English
Pages (from-to)	22-30
Journal	Circuit World
Volume	35
Issue number	4
DOIs	https://doi.org/10.1108/03056120911002389
Publication status	Published - 2009
Publication type	A1 Journal article-refereed

Publication forum classification

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title = "Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards",

author = "T. Laine-Ma and P. Ruuskanen and S. Kortet and M. Karttunen",

note = "Circuit World -lehden {"}Outstanding Paper Award{"} -palkinto v. 2010<br/>Contribution: organisation=pori,FACT1=1",

year = "2009",

doi = "10.1108/03056120911002389",

language = "English",

volume = "35",

pages = "22--30",

journal = "Circuit World",

issn = "0305-6120",

publisher = "Emerald Group Publishing Ltd.",

number = "4",

}

TY - JOUR

T1 - Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards

AU - Laine-Ma, T.

AU - Ruuskanen, P.

AU - Kortet, S.

AU - Karttunen, M.

N1 - Circuit World -lehden "Outstanding Paper Award" -palkinto v. 2010<br/>Contribution: organisation=pori,FACT1=1

PY - 2009

Y1 - 2009

U2 - 10.1108/03056120911002389

DO - 10.1108/03056120911002389

M3 - Article

SN - 0305-6120

VL - 35

SP - 22

EP - 30

JO - Circuit World

JF - Circuit World

IS - 4

ER -