Evaluation of printed electronics manufacturing line with sensor platform application

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

11 Citations (Scopus)

Translated title of the contribution	Evaluation of printed electronics manufacturing line with sensor platform application
Original language	English
Title of host publication	EMPC2009, 17th European Microelectronics and Packaging Conference & Exhibition, June 15-18, 2009, Rimini, Italy
Pages	8 p
Publication status	Published - 2009
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{00d6c7f0f1474e2b80e8f5799c896129,

title = "Evaluation of printed electronics manufacturing line with sensor platform application",

author = "E. Halonen and K. Kaija and M. M{\"a}ntysalo and A. Kemppainen and R. {\"O}sterbacka",

note = "Contribution: organisation=ele,FACT1=1",

year = "2009",

language = "English",

pages = "8 p",

booktitle = "EMPC2009, 17th European Microelectronics and Packaging Conference \& Exhibition, June 15-18, 2009, Rimini, Italy",

}

Evaluation of printed electronics manufacturing line with sensor platform application. / Halonen, E.; Kaija, K.; Mäntysalo, M. et al.
EMPC2009, 17th European Microelectronics and Packaging Conference & Exhibition, June 15-18, 2009, Rimini, Italy. 2009. p. 8 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Evaluation of printed electronics manufacturing line with sensor platform application

AU - Halonen, E.

AU - Kaija, K.

AU - Mäntysalo, M.

AU - Kemppainen, A.

AU - Österbacka, R.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2009

Y1 - 2009

M3 - Conference contribution

SP - 8 p

BT - EMPC2009, 17th European Microelectronics and Packaging Conference & Exhibition, June 15-18, 2009, Rimini, Italy

ER -