Fabrication and characterization of screen printed stretchable carbon interconnects

M. Mosallaei, B. Khorramdel, M. Honkanen, P. Iso-Ketola, J. Vanhala, M. Mäntysalo

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    3 Citations (Scopus)

    Abstract

    Electronic devices that are deformable in arbitrary directions would open up a new generation of applications such as epidermal electronics, implantable electronics and soft robotics. It would not be feasible to fabricate them with conventional rigid materials. To make the electronics stretchable, one can miniaturize the functional units and link them by stretchable interconnects. In this paper, we report a method for fabrication and characterization of stretchable interconnects using deformable materials based on carbon ink and thermoplastic polyurethane. The static resistances of interconnects were on average 296 Ω/□, and half of the samples withstood single strain up to 108 % elongation. Fabricated samples survived a 1000 cycles strain test up to 40 % of stretching.
    Original languageEnglish
    Title of host publication2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
    PublisherIEEE
    Pages78-83
    Number of pages6
    ISBN (Print)978-1-5386-3055-6
    DOIs
    Publication statusPublished - 2017
    Publication typeA4 Article in conference proceedings
    EventIMAPS Nordic Conference on Microelectronics Packaging -
    Duration: 1 Jan 2000 → …

    Conference

    ConferenceIMAPS Nordic Conference on Microelectronics Packaging
    Period1/01/00 → …

    Keywords

    • printed electronics
    • screen printing
    • stretchable electronics
    • viscoelastic substrates

    Publication forum classification

    • Publication forum level 1

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