Fabrication of soft devices with buried fluid channels by using sacrificial 3D printed molds

Anastasia Koivikko, Veikko Sariola

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    9 Citations (Scopus)

    Abstract

    Casting silicone elastomers into 3D printed molds has seen a surge of applications in soft robots, soft manipulators, microfluidics, wearable technologies and stretchable sensors. In such devices, buried fluid channels are used to transport fluids, as fluidic actuators and as sensors with liquid metal. However, it is difficult to demold structures with buried channels or overhangs. As a solution, using sacrificial molds made of dissolvable materials has been proposed. In this paper, we evaluate different commercially available 3D printing materials as dissolvable mold materials. We tested dissolving prints made of high-impact polystyrene (HIPS), acrylonitrile butadiene styrene (ABS), polyvinyl butyral (PVB) and polyvinyl alcohol (PVA) in limonene, acetone, isopropanol/ethanol and water, respectively. We further studied the effect of magnetic stirring and ultrasonic bath on the dissolution times. Finally, we fabricated buried channels using different mold materials and silicone elastomers. The results show that at least ABS, PVB and PVA can be used as mold materials. In particular, PVA is a promising material as it is soluble in water. The studied method simplifies the fabrication of soft devices, allowing the fabrication of overhangs and buried channels in a single casting step.

    Original languageEnglish
    Title of host publication2019 2nd IEEE International Conference on Soft Robotics (RoboSoft)
    PublisherIEEE
    Pages509-513
    Number of pages5
    ISBN (Electronic)9781538692608
    DOIs
    Publication statusPublished - 24 May 2019
    Publication typeA4 Article in conference proceedings
    EventIEEE International Conference on Soft Robotics, RoboSoft - Seoul, Korea, Republic of
    Duration: 14 Apr 201918 Apr 2019

    Conference

    ConferenceIEEE International Conference on Soft Robotics, RoboSoft
    Country/TerritoryKorea, Republic of
    CitySeoul
    Period14/04/1918/04/19

    Publication forum classification

    • Publication forum level 1

    ASJC Scopus subject areas

    • Materials Science (miscellaneous)
    • Artificial Intelligence
    • Mechanical Engineering
    • Control and Optimization

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