Failure mechanisms of adhesive flip chip joints

A. Seppälä, T. Allinniemi, E. Ristolainen

Research output: Contribution to journal › Article › Scientific › peer-review

10 Citations (Scopus)

Translated title of the contribution	Failure mechanisms of adhesive flip chip joints
Original language	English
Pages (from-to)	1547-1550
Journal	Microelectronics Reliability
Volume	42
Issue number	9-11
Publication status	Published - 2002
Publication type	A1 Journal article-refereed

Publication forum classification

@article{442ef22343c64fe6b4c4796f2a7d8971,

title = "Failure mechanisms of adhesive flip chip joints",

author = "A. Sepp{\"a}l{\"a} and T. Allinniemi and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2002",

language = "English",

volume = "42",

pages = "1547--1550",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Limited",

number = "9-11",

}