Flip Chip Attachement on Rigid Substrates Using Anisotropics Conductive Adhesive Films

A. Seppälä

Research output: Book/Report › Doctoral thesis › Collection of Articles

Translated title of the contribution	Flip Chip Attachement on Rigid Substrates Using Anisotropics Conductive Adhesive Films
Original language	English
Place of Publication	Tampere
Publisher	Tampere University of Technology
Publication status	Published - 2003
Publication type	G5 Doctoral dissertation (articles)

Name	Tampereen teknillinen yliopisto, Julkaisuja
Publisher	Tampere University of Technology
No.	433

Publication forum classification

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note = "Awarding institution:Tampere University of Technology",

year = "2003",

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series = "Tampereen teknillinen yliopisto, Julkaisuja",

publisher = "Tampere University of Technology",

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Y1 - 2003

M3 - Doctoral thesis

T3 - Tampereen teknillinen yliopisto, Julkaisuja

BT - Flip Chip Attachement on Rigid Substrates Using Anisotropics Conductive Adhesive Films

PB - Tampere University of Technology

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