Flip Chip Attachement on Rigid Substrates Using Anisotropics Conductive Adhesive Films

Research output: Book/Report › Doctoral thesis › Collection of Articles

Translated title of the contribution	Flip Chip Attachement on Rigid Substrates Using Anisotropics Conductive Adhesive Films
Original language	English
Place of Publication	Tampere
Publisher	Tampere University of Technology
Publication status	Published - 2003
Publication type	G5 Doctoral dissertation (articles)

Name	Tampereen teknillinen yliopisto, Julkaisuja
Publisher	Tampere University of Technology
No.	433

Publication forum classification

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title = "Flip Chip Attachement on Rigid Substrates Using Anisotropics Conductive Adhesive Films",

author = "A. Sepp{\"a}l{\"a}",

note = "Awarding institution:Tampere University of Technology",

year = "2003",

language = "English",

series = "Tampereen teknillinen yliopisto, Julkaisuja",

publisher = "Tampere University of Technology",

number = "433",

}

TY - BOOK

T1 - Flip Chip Attachement on Rigid Substrates Using Anisotropics Conductive Adhesive Films

AU - Seppälä, A.

N1 - Awarding institution:Tampere University of Technology

PY - 2003

Y1 - 2003

M3 - Doctoral thesis

T3 - Tampereen teknillinen yliopisto, Julkaisuja

BT - Flip Chip Attachement on Rigid Substrates Using Anisotropics Conductive Adhesive Films

PB - Tampere University of Technology

CY - Tampere

ER -