Flip chip attachment on flexible LCP substrate using an ACF

L. Frisk, E. Ristolainen

Research output: Contribution to journal › Article › Scientific › peer-review

35 Citations (Scopus)

Translated title of the contribution	Flip chip attachment on flexible LCP substrate using an ACF
Original language	English
Pages (from-to)	583-588
Journal	Microelectronics Reliability
Volume	45
Publication status	Published - 2005
Publication type	A1 Journal article-refereed

Publication forum classification

@article{bf4ff9c3492e417492ec3f9c0adacedc,

title = "Flip chip attachment on flexible LCP substrate using an ACF",

author = "L. Frisk and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2005",

language = "English",

volume = "45",

pages = "583--588",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Limited",

}