Flip chip attachment on flexible pen-substrate using an ACF

L. Frisk; E. Ristolainen

Flip chip attachment on flexible pen-substrate using an ACF

L. Frisk
, E. Ristolainen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	Flip chip attachment on flexible pen-substrate using an ACF
Original language	English
Title of host publication	3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, 21-23 October 2003, Montreux, Switzerland
Pages	345-349
Publication status	Published - 2003
Publication type	A4 Article in conference proceedings

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Cite this

@inproceedings{1ab99904e845497691c5faf765b3c954,

title = "Flip chip attachment on flexible pen-substrate using an ACF",

author = "L. Frisk and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2003",

language = "English",

pages = "345--349",

booktitle = "3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, 21-23 October 2003, Montreux, Switzerland",

}