Flip chip joining of MEMS components using SnPbAg and solder bumps

K. Kokko, S. Nurmi, E. Ristolainen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	Flip chip joining of MEMS components using SnPbAg and solder bumps
Original language	English
Title of host publication	Proceedings of 2004 International Symposium on Microelectronics, November 14-18, 2004, Long Beach, CA, USA
Pages	6 p
Publication status	Published - 2004
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{97fc7a7cdd574a7a9042baaf9383015f,

title = "Flip chip joining of MEMS components using SnPbAg and solder bumps",

author = "K. Kokko and S. Nurmi and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2004",

language = "English",

pages = "6 p",

booktitle = "Proceedings of 2004 International Symposium on Microelectronics, November 14-18, 2004, Long Beach, CA, USA",

}