Flip chip joining of thin chips on flexible PEN substrate

E. Jokinen; E. Ristolainen

Flip chip joining of thin chips on flexible PEN substrate

E. Jokinen, E. Ristolainen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific

7 Citations (Scopus)

Translated title of the contribution	Flip chip joining of thin chips on flexible PEN substrate
Original language	English
Title of host publication	Proceedings, IMAPS 2001, 34th International Symposium on Microelectronics, October 9-11, 2001, Baltimore Convention Center, Baltimore, USA
Pages	600-604
Publication status	Published - 2001
Publication type	B3 Article in conference proceedings

Publication forum classification

No publication forum level

Access to Document

http://www.imaps.org

Cite this

@inproceedings{aee2dfea43a5441082e082bc212250db,

title = "Flip chip joining of thin chips on flexible PEN substrate",

author = "E. Jokinen and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2001",

language = "English",

pages = "600--604",

booktitle = "Proceedings, IMAPS 2001, 34th International Symposium on Microelectronics, October 9-11, 2001, Baltimore Convention Center, Baltimore, USA",

}

TY - GEN

T1 - Flip chip joining of thin chips on flexible PEN substrate

AU - Jokinen, E.

AU - Ristolainen, E.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2001

Y1 - 2001

M3 - Conference contribution

SP - 600

EP - 604

BT - Proceedings, IMAPS 2001, 34th International Symposium on Microelectronics, October 9-11, 2001, Baltimore Convention Center, Baltimore, USA

ER -