Flip Chip Joining on FR-4 Substrate Using ACFs

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Translated title of the contribution	Flip Chip Joining on FR-4 Substrate Using ACFs
Original language	English
Pages (from-to)	148-159
Journal	The International Journal of Microdircuts and Electronic Packaging
Volume	24
Issue number	2
Publication status	Published - 2001
Publication type	A1 Journal article-refereed

Publication forum classification

@article{909d5ef57e334290a271936fd0b45a9b,

title = "Flip Chip Joining on FR-4 Substrate Using ACFs",

author = "A. Sepp{\"a}l{\"a} and S. Pienimaa",

note = "JCR: ei; Ulrich's: Refereed (International Journal for Microcircuits and Electronic Packaging)<br/>Contribution: organisation=ele,FACT1=1",

year = "2001",

language = "English",

volume = "24",

pages = "148--159",

journal = "The International Journal of Microdircuts and Electronic Packaging",

number = "2",

}

TY - JOUR

T1 - Flip Chip Joining on FR-4 Substrate Using ACFs

AU - Seppälä, A.

AU - Pienimaa, S.

N1 - JCR: ei; Ulrich's: Refereed (International Journal for Microcircuits and Electronic Packaging)<br/>Contribution: organisation=ele,FACT1=1

PY - 2001

Y1 - 2001

M3 - Article

VL - 24

SP - 148

EP - 159

JO - The International Journal of Microdircuts and Electronic Packaging

JF - The International Journal of Microdircuts and Electronic Packaging

IS - 2

ER -