Fully inkjet-printed multilayer microstrip and T-resonator structures for the RF characterization of printable materials and interconnects

B. K. Tehrani; J. Bito; B. S. Cook; M. M. Tentzeris

doi:10.1109/MWSYM.2014.6848664

Fully inkjet-printed multilayer microstrip and T-resonator structures for the RF characterization of printable materials and interconnects

B. K. Tehrani, J. Bito, B. S. Cook, M. M. Tentzeris

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

27 Citations (Scopus)

Abstract

A vertically-integrated, fully inkjet-printed microwave structure is demonstrated for the first time, where both the metallic elements and the platform substrate are completely fabricated with the additive inkjet printing process. The surface uniformity of SU-8 polymer ink is outlined as a function of layer deposition to provide a desirable profile for a thick RF substrate application. Inkjet-printed vias are demonstrated and realized as microwave substrate interconnects within SU-8. Microstrip and T-resonator structures are developed to demonstrate the application of these inkjet-printed platforms for the RF characterization of a printable material, where the relative permittivity of the substrate is extracted as a function of frequency from 1-30 GHz.

Original language	English
Title of host publication	2014 IEEE MTT-S International Microwave Symposium, IMS 2014
Publisher	IEEE
ISBN (Print)	9781479938698
DOIs	https://doi.org/10.1109/MWSYM.2014.6848664
Publication status	Published - 2014
Publication type	A4 Article in conference proceedings
Event	2014 IEEE MTT-S International Microwave Symposium, IMS 2014 - Tampa, FL, United States Duration: 1 Jun 2014 → 6 Jun 2014

Conference

Conference	2014 IEEE MTT-S International Microwave Symposium, IMS 2014
Country/Territory	United States
City	Tampa, FL
Period	1/06/14 → 6/06/14

Keywords

Dielectric Substrates
Inkjet Printing
Interconnects
Low-Cost Electronics
Printed Circuits
T-Resonator

ASJC Scopus subject areas

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1109/MWSYM.2014.6848664

Cite this

@inproceedings{9730e4ebc6b04d58972efbc8b23e967f,

title = "Fully inkjet-printed multilayer microstrip and T-resonator structures for the RF characterization of printable materials and interconnects",

abstract = "A vertically-integrated, fully inkjet-printed microwave structure is demonstrated for the first time, where both the metallic elements and the platform substrate are completely fabricated with the additive inkjet printing process. The surface uniformity of SU-8 polymer ink is outlined as a function of layer deposition to provide a desirable profile for a thick RF substrate application. Inkjet-printed vias are demonstrated and realized as microwave substrate interconnects within SU-8. Microstrip and T-resonator structures are developed to demonstrate the application of these inkjet-printed platforms for the RF characterization of a printable material, where the relative permittivity of the substrate is extracted as a function of frequency from 1-30 GHz.",

keywords = "Dielectric Substrates, Inkjet Printing, Interconnects, Low-Cost Electronics, Printed Circuits, T-Resonator",

author = "Tehrani, {B. K.} and J. Bito and Cook, {B. S.} and Tentzeris, {M. M.}",

year = "2014",

doi = "10.1109/MWSYM.2014.6848664",

language = "English",

isbn = "9781479938698",

booktitle = "2014 IEEE MTT-S International Microwave Symposium, IMS 2014",

publisher = "IEEE",

address = "United States",

note = "2014 IEEE MTT-S International Microwave Symposium, IMS 2014 ; Conference date: 01-06-2014 Through 06-06-2014",

}

Tehrani, BK, Bito, J, Cook, BS & Tentzeris, MM 2014, Fully inkjet-printed multilayer microstrip and T-resonator structures for the RF characterization of printable materials and interconnects. in 2014 IEEE MTT-S International Microwave Symposium, IMS 2014., 6848664, IEEE, 2014 IEEE MTT-S International Microwave Symposium, IMS 2014, Tampa, FL, United States, 1/06/14. https://doi.org/10.1109/MWSYM.2014.6848664

Fully inkjet-printed multilayer microstrip and T-resonator structures for the RF characterization of printable materials and interconnects. / Tehrani, B. K.; Bito, J.; Cook, B. S. et al.
2014 IEEE MTT-S International Microwave Symposium, IMS 2014. IEEE, 2014. 6848664.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Fully inkjet-printed multilayer microstrip and T-resonator structures for the RF characterization of printable materials and interconnects

AU - Tehrani, B. K.

AU - Bito, J.

AU - Cook, B. S.

AU - Tentzeris, M. M.

PY - 2014

Y1 - 2014

N2 - A vertically-integrated, fully inkjet-printed microwave structure is demonstrated for the first time, where both the metallic elements and the platform substrate are completely fabricated with the additive inkjet printing process. The surface uniformity of SU-8 polymer ink is outlined as a function of layer deposition to provide a desirable profile for a thick RF substrate application. Inkjet-printed vias are demonstrated and realized as microwave substrate interconnects within SU-8. Microstrip and T-resonator structures are developed to demonstrate the application of these inkjet-printed platforms for the RF characterization of a printable material, where the relative permittivity of the substrate is extracted as a function of frequency from 1-30 GHz.

AB - A vertically-integrated, fully inkjet-printed microwave structure is demonstrated for the first time, where both the metallic elements and the platform substrate are completely fabricated with the additive inkjet printing process. The surface uniformity of SU-8 polymer ink is outlined as a function of layer deposition to provide a desirable profile for a thick RF substrate application. Inkjet-printed vias are demonstrated and realized as microwave substrate interconnects within SU-8. Microstrip and T-resonator structures are developed to demonstrate the application of these inkjet-printed platforms for the RF characterization of a printable material, where the relative permittivity of the substrate is extracted as a function of frequency from 1-30 GHz.

KW - Dielectric Substrates

KW - Inkjet Printing

KW - Interconnects

KW - Low-Cost Electronics

KW - Printed Circuits

KW - T-Resonator

UR - http://www.scopus.com/inward/record.url?scp=84905002256&partnerID=8YFLogxK

U2 - 10.1109/MWSYM.2014.6848664

DO - 10.1109/MWSYM.2014.6848664

M3 - Conference contribution

AN - SCOPUS:84905002256

SN - 9781479938698

BT - 2014 IEEE MTT-S International Microwave Symposium, IMS 2014

PB - IEEE

T2 - 2014 IEEE MTT-S International Microwave Symposium, IMS 2014

Y2 - 1 June 2014 through 6 June 2014

ER -

Fully inkjet-printed multilayer microstrip and T-resonator structures for the RF characterization of printable materials and interconnects

Abstract

Conference

Keywords

ASJC Scopus subject areas

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