@inproceedings{d61dcc9e71d3483985e53b425950606f,
title = "Hermetic and radiation tolerant glass package for vcsels using novel micro bonding method",
abstract = "In this study, we use novel glass micro bonding method to manufacture hermetic and radiation tolerant all-in-glass packages for vertical cavity surface emitting lasers (VCSEL) suitable for space applications. Thermal analysis demonstrates that the properties of the designed Leadless Glass Package (LGP) are well-suited for the intended conditions, even at higher temperatures than required. Evaluation tests show excellent device functionality and robust package structure. The same design could easily be adapted to other glass types, such as Borofloat 33, and end applications such as MEMS and active implants. The assembly design and technologies are well-suited for commercial volume scale manufacturing.",
keywords = "All-in-glass packaging, Glass, Hermetic, Vcsel",
author = "H. Lunden and A. Maattanen and I. Oxtoby",
note = "Publisher Copyright: {\textcopyright} 2019 IMAPS-Europe.; 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019 ; Conference date: 16-09-2019 Through 19-09-2019",
year = "2019",
month = sep,
day = "16",
doi = "10.23919/EMPC44848.2019.8951865",
language = "English",
series = "2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019",
publisher = "IEEE",
booktitle = "2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019",
address = "United States",
}