Hermetic and radiation tolerant glass package for vcsels using novel micro bonding method

H. Lunden, A. Maattanen, I. Oxtoby

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Abstract

In this study, we use novel glass micro bonding method to manufacture hermetic and radiation tolerant all-in-glass packages for vertical cavity surface emitting lasers (VCSEL) suitable for space applications. Thermal analysis demonstrates that the properties of the designed Leadless Glass Package (LGP) are well-suited for the intended conditions, even at higher temperatures than required. Evaluation tests show excellent device functionality and robust package structure. The same design could easily be adapted to other glass types, such as Borofloat 33, and end applications such as MEMS and active implants. The assembly design and technologies are well-suited for commercial volume scale manufacturing.

Original languageEnglish
Title of host publication2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
ISBN (Electronic)9780956808660
DOIs
Publication statusPublished - 16 Sept 2019
Externally publishedYes
Publication typeA4 Article in conference proceedings
Event22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019 - Pisa, Italy
Duration: 16 Sept 201919 Sept 2019

Publication series

Name2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019

Conference

Conference22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
Country/TerritoryItaly
CityPisa
Period16/09/1919/09/19

Keywords

  • All-in-glass packaging
  • Glass
  • Hermetic
  • Vcsel

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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