High density flip chip assembly on novel printed circuit board

T. Uusluoto, J. Määttänen, P. Palm, A. Tuominen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Translated title of the contributionHigh density flip chip assembly on novel printed circuit board
    Original languageEnglish
    Title of host publication2003 ICEP International conference on electronics packaging (Formerly IEMT/IMC symposium), April 16-18, 2003, Tokyo, Japan
    Pages460-464
    Publication statusPublished - 2003
    Publication typeA4 Article in conference proceedings

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