Translated title of the contribution | High density flip chip assembly on novel printed circuit board |
---|---|
Original language | English |
Title of host publication | 2003 ICEP International conference on electronics packaging (Formerly IEMT/IMC symposium), April 16-18, 2003, Tokyo, Japan |
Pages | 460-464 |
Publication status | Published - 2003 |
Publication type | A4 Article in conference proceedings |
Publication forum classification
- No publication forum level