High Temperature Testing of ECA Materials in Sensor Applications

Sanna Lahokallio; Laura Frisk

High Temperature Testing of ECA Materials in Sensor Applications

Sanna Lahokallio, Laura Frisk

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Translated title of the contribution	High Temperature Testing of ECA Materials in Sensor Applications
Original language	English
Title of host publication	Proceedings of the IMAPS Nordic Annual Conference, September 2-4, 2012, Helsingør, Denmark
Editors	Kutilainen Jarkko
Place of Publication	Mölndal, Sweden
Publisher	International Microelectronics and Packaging Society, Nordic
Pages	133-139
ISBN (Print)	978-1-62276-316-0
Publication status	Published - 2012
Publication type	A4 Article in conference proceedings

Publication series

Name	International Microelectronics and Packaging Society Nordic Annual Conference

Publication forum classification

No publication forum level

Cite this

Lahokallio, S., & Frisk, L. (2012). High Temperature Testing of ECA Materials in Sensor Applications. In K. Jarkko (Ed.), Proceedings of the IMAPS Nordic Annual Conference, September 2-4, 2012, Helsingør, Denmark (pp. 133-139). (International Microelectronics and Packaging Society Nordic Annual Conference). International Microelectronics and Packaging Society, Nordic.

Lahokallio, Sanna ; Frisk, Laura. / High Temperature Testing of ECA Materials in Sensor Applications. Proceedings of the IMAPS Nordic Annual Conference, September 2-4, 2012, Helsingør, Denmark. editor / Kutilainen Jarkko. Mölndal, Sweden : International Microelectronics and Packaging Society, Nordic, 2012. pp. 133-139 (International Microelectronics and Packaging Society Nordic Annual Conference).

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Lahokallio, S & Frisk, L 2012, High Temperature Testing of ECA Materials in Sensor Applications. in K Jarkko (ed.), Proceedings of the IMAPS Nordic Annual Conference, September 2-4, 2012, Helsingør, Denmark. International Microelectronics and Packaging Society Nordic Annual Conference, International Microelectronics and Packaging Society, Nordic, Mölndal, Sweden, pp. 133-139.

High Temperature Testing of ECA Materials in Sensor Applications. / Lahokallio, Sanna; Frisk, Laura.
Proceedings of the IMAPS Nordic Annual Conference, September 2-4, 2012, Helsingør, Denmark. ed. / Kutilainen Jarkko. Mölndal, Sweden: International Microelectronics and Packaging Society, Nordic, 2012. p. 133-139 (International Microelectronics and Packaging Society Nordic Annual Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

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T1 - High Temperature Testing of ECA Materials in Sensor Applications

AU - Lahokallio, Sanna

AU - Frisk, Laura

N1 - ei ut-numeroa 20.8.2013<br/>Contribution: organisation=ele,FACT1=1<br/>Publisher name: International Microelectronics and Packaging Society, Nordic

PY - 2012

Y1 - 2012

M3 - Conference contribution

SN - 978-1-62276-316-0

T3 - International Microelectronics and Packaging Society Nordic Annual Conference

SP - 133

EP - 139

BT - Proceedings of the IMAPS Nordic Annual Conference, September 2-4, 2012, Helsingør, Denmark

A2 - Jarkko, Kutilainen

PB - International Microelectronics and Packaging Society, Nordic

CY - Mölndal, Sweden

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Lahokallio S, Frisk L. High Temperature Testing of ECA Materials in Sensor Applications. In Jarkko K, editor, Proceedings of the IMAPS Nordic Annual Conference, September 2-4, 2012, Helsingør, Denmark. Mölndal, Sweden: International Microelectronics and Packaging Society, Nordic. 2012. p. 133-139. (International Microelectronics and Packaging Society Nordic Annual Conference).