Hydrolysis testing of ACF joined flip chip components with conformal coating

K. Kokko, H. Harjunpää, P. Heino, M. Kellomäki

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific

1 Citation (Scopus)

Translated title of the contribution	Hydrolysis testing of ACF joined flip chip components with conformal coating
Original language	English
Title of host publication	EMPC2009. 17th European Microelectronics and Packaging Conference & Exhibition, June 15 - 18, 2009, Rimini, Italy
Pages	6 p
Publication status	Published - 2009
Publication type	B3 Article in conference proceedings

Publication forum classification

@inproceedings{90a28768aca94746b79613167fc4409f,

title = "Hydrolysis testing of ACF joined flip chip components with conformal coating",

author = "K. Kokko and H. Harjunp{\"a}{\"a} and P. Heino and M. Kellom{\"a}ki",

note = "ELE 50% - BME 50%<br/>Contribution: organisation=ele,FACT1=0.5<br/>Contribution: organisation=bme,FACT2=0.5",

year = "2009",

language = "English",

pages = "6 p",

booktitle = "EMPC2009. 17th European Microelectronics and Packaging Conference & Exhibition, June 15 - 18, 2009, Rimini, Italy",

}

TY - GEN

T1 - Hydrolysis testing of ACF joined flip chip components with conformal coating

AU - Kokko, K.

AU - Harjunpää, H.

AU - Heino, P.

AU - Kellomäki, M.

N1 - ELE 50% - BME 50%<br/>Contribution: organisation=ele,FACT1=0.5<br/>Contribution: organisation=bme,FACT2=0.5

PY - 2009

Y1 - 2009

M3 - Conference contribution

SP - 6 p

BT - EMPC2009. 17th European Microelectronics and Packaging Conference & Exhibition, June 15 - 18, 2009, Rimini, Italy

ER -