Improved Adhesion between a Sputtered Alumina Coating and a Copper Substrate

R. Järvinen, T. Mäntylä, P. Kettunen

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Translated title of the contribution	Improved Adhesion between a Sputtered Alumina Coating and a Copper Substrate
Original language	English
Pages (from-to)	s. 311-
Journal	Thin Solid Films
Volume	114
Publication status	Published - 1984
Publication type	A1 Journal article-refereed

Publication forum classification

@article{c82118bebd924693a6f4409f37493307,

title = "Improved Adhesion between a Sputtered Alumina Coating and a Copper Substrate",

author = "R. J{\"a}rvinen and T. M{\"a}ntyl{\"a} and P. Kettunen",

note = "Contribution: organisation=mol,FACT1=1<br/>Publisher name: Elsevier",

year = "1984",

language = "English",

volume = "114",

pages = "s. 311--",

journal = "Thin Solid Films",

issn = "0040-6090",

publisher = "Elsevier B.V.",

}